In This Issue

The November 2023 issue of In Compliance concentrates on Electromagnetic Compatibility.

ESD Co-Design for High-Speed SerDes in FinFET Technologies
By Peter de Jong for the EOS/ESD Association, Inc.
The narrow ESD design window in current FinFET technologies creates a special challenge for the robust ESD design of high-speed interfaces. Smart circuit-ESD co-design can help achieve the required ESD robustness without deteriorating functional performance.

The EU’s New Product Safety Law Will Be a Game Changer

By Rutger Oldenhuis
The world of non-food consumer products has undergone significant changes over the past two decades. New technologies and online sales are the primary drivers behind the upcoming new Product Safety law, which is set to bring about a substantial transformation in the landscape of product safety when it takes effect by the end of 2024.

Reduced-Order Modeling of Pennes’ Bioheat Equation for Thermal Dose Analysis

By Harry Alexander James Watson and Francesco Colella
This article presents methods for building reduced-order models (ROMs) based on proper orthogonal decomposition (POD) for modeling transient heat transfer in partially-perfuse tissue in prolonged contact with a heat-generating wearable device.

The Duty to Warn

By Kenneth Ross
Even though warnings and instructions are not followed by all product users, they are important for product safety and product liability defensibility. Manufacturers must decide how safe to design their products and when they can also rely on warnings and instructions to make the product safe.


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