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In This Issue:

The July issue focuses on EMC Compliance. Our feature article, awarded Best Symposium Paper at IEEE EMC+SIPI 2019, investigates fundamental mathematical and statistical algorithms for the spatiospectral analysis of electromagnetic coupling in large, complex electronic systems. Next, Vladimir Kraz provides hands-on guidance to specialists at factories and elsewhere on measuring conducted EMI where it matters – in their environment. Michel Mardiguian describes a quick and handy formula and nomogram providing a fair estimate of the filter or shield response to a conducted or radiated threat. The final article identifies areas of risk in some ESD design methods.

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What's in this month's issue?

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A Novel Statistical Model for the Electromagnetic Coupling to Electronics inside Enclosures

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p.40

Measurements of Conducted EMI in the Manufacturing Environment

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p.52

Fast Evaluation of a Filter or Shield Against an Electromagnetic Pulse

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p.60

Impact from IC On-Chip Protection Design on EOS

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Plus, don't miss...

p.6

Compliance News

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p.8

EMC Concepts Explained
Dipole-Type Antennas in EMC Testing: Part 2

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p.14

Hot Topics in ESD 
How Do You Compare ANSI/ESD S20.20 and MIL-STD-1686?

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p.16

On Your Mark 
“Keep Out of Reach of Children” Symbol in Focus

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p.20

EOS/ESD Association 
Industry Council Launches Survey on Latch-up

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p.64

Product Showcase 
Explore current products and services

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